The P-278C combines compact design with powerful nationwide communication capabilities.
Operating over LTE cellular networks, it eliminates traditional distance limitations and enables instant communication across cities, states and regions.
With support for private calls, group calls and all-call functions, the device is ideal for organizations requiring efficient team coordination without investing in repeater systems or radio infrastructure.
| P-278C Technical Specification | |||
| Product Parameters | |||
| General | |||
| Type | P-278C | ||
| Equipment Name | Push-to-Talk Over Cellular Radio | ||
| Working Voltage | DC:3.4V-4.2V; Typical Value:3.7V | ||
| Network System | 4G | ||
| Frequency Range CAT.1 | America ·LTE(FDD):1/2/3/4/5/7/8/20/28.LTE(TDD):34/38/39/40/41n Europe ·LTE(FD0):1/2/3/4/5/7/8/12/13/17·LTE(TDD):34/38/39/40/41n | ||
| Maximum Transmit Power | TDD-LTE Power Class 3(23 +/-2dBm) / FDD-LTE Power Class 3(23 +/-2dBm) | ||
| Stand-by Time | Typical Standby | ||
| Receiving Sensitivity | TDD-LTE -94 dBm(20MHZ) / FDD-LTE -94 dBm(20MHZ) | ||
| Rate Audio Power | 500mW | ||
| Battery | Standard Thin Battery: Polymer Lithium Battery 2000mA | ||
| Charge Mode | TYPE-C | ||
| Antenna | Built In FPC Antenna | ||
| Operating Temperature | -20℃ ~ +50℃ | ||
| Weight | 174g | ||
| Size: Length*Width*Thickness(mm) | 98*58*35(Without Antenna) | ||
| SIM Card | Nano SIM | ||
| Main Function | |||
| 1.45-inch Color Screen | |||
| Polymer Lithium Battery | |||
| Ultra Long Standby Time | |||
| Nationwide Intercom. Private call/Group call/All Call | |||
| Multi-group Listening(This Feature Requires Consultation With The Platform Provider) | |||
| Multi-member Single Call(This Feature Requires Consultation With The Platform Provider) | |||
| Intercom Prompt Sound Switch | |||
| Key Lock | |||
| Battery Level Display/Low Battery Alert | |||
| Platform :REALPTT/XIN POC |
1 × Portable radio
1 × Antenna
1 × Li-ion battery pack
1 ×usb charger
1 ×Belt clip
1 ×The sling
Custom logo printing, private labeling, customized packaging, firmware development and OEM/ODM communication solutions are available for distributors and system integrators worldwide.
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